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| hall ic series / hall ic(latch type) bipolar detection hall ics (with polarity discrimination output) ? ? bu52004gul, bu52014hfv description the bu52004gul and bu52014hfv are bipolar hall ics incorporating a polarity determination circuit that enables operation (output) on both the s- and n-poles, with the polarity judgment based on the output processing configuration. these hall ic products can be in with movie, mobile phone and other applications involving crystal panels to detect the (front-back) location or determine the rotational direction of the panel. features 1) bipolar detection (polarity detection for both s and n features dual outputs) 2) micropower operation (small current using intermittent operation method) 3) ultra-compact csp4 package(bu52004gul) 4) small outline package (bu52014hfv) 5) line up of supply voltage for 1.8v power supply voltage bu52014hfv) ? ? for 3.0v power su pply voltage (bu52004gul) 6) polarity judgment and output on both poles (out1: s-pole output; out2: n-pole output) 7) high esd resistance 8kv(hbm) applications mobile phones, notebook computers, digital vi deo camera, digital still camera, etc. product lineup product name supply voltage (v) operate point (mt) hysteresis (mt) period (ms) supply current (avg. ) ( a) output type package bu52004gul 2.40 3.30 +/-3.7 0.8 50 8.0 cmos vcsp50l1 bu52014hfv 1.65 3.30 +/-3.0 0.9 50 5.0 cmos hvsof5 plus is expressed on the s-pole; minus on the n-pole june 2008
2/12 ? absolute maximum ratings bu52004gul (ta=25 ) bu52014gul (ta=25 ) magnetic, electrical characteristics bu52004gul ( v dd 3.0v, ta 25 ? ) parameters symbol limit unit conditions min typ max power supply voltage v dd 2.4 3.0 3.3 v operate point b ops - 3.7 5.5 mt output out1 (respond the south pole) b opn -5.5 -3.7 - output out2 (respond the north pole) release point b rps 0.8 2.9 - mt output out1 (respond the south pole) b rpn - -2.9 -0.8 output out2 (respond the north pole) hysteresis b hyss - 0.8 - mt b hysn - 0.8 - period t p - 50 100 ms output high vol age v oh v dd -0.4 - - v b rpn v dd 1.80v, ta 25 ? ) parameters symbol limit unit conditions min typ max power supply voltage v dd 1.65 1.80 3.30 v operate point b ops - 3.0 5.0 mt output out1 (respond the south pole) b opn -5.0 -3.0 - output out2 (respond the north pole) release point b rps 0.6 2.1 - mt output out1 (respond the south pole) b rpn - -2.1 -0.6 output out2 (respond the north pole) hysteresis b hyss - 0.9 - mt b hysn - 0.9 - period t p - 50 100 ms output high vol age v oh v dd -0.2 - - v b rpn - 8 12 a v dd =2.7v, average supply current during startup time 2 i dd2(en) - 4.5 - ma v dd =2.7v, during startup time value supply current during standby time 2 i dd2(dis) - 4.0 - a v dd =2.7v, during standby time value 6. b = magnetic flux density 1mt=10gauss positive (?+?) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. after applying power supply, it takes one cycle of period (t p ) to become definite output. radiation hardiness is not designed. 4/12 ? figure of measurement circuit ? product name i out bu52004gul 1.0ma bu52014hfv 0.5ma product name i out bu52004gul 1.0ma bu52014hfv 0.5ma b op /b rp vdd vdd gnd out 100 f v t p 200 vdd vdd gnd out v oh vdd vdd gnd out 100 f v i out v ol vdd vdd gnd out 100 f v i out oscilloscope the period is monitored by oscilloscope. ? bop and brp are measured with applying the magnetic field from the outside. fig.1 b op ,b rp measurement circuit fig.2 t p measurement circuit fig.3 v oh measurement circuit fig.4 v ol measurement circuit i dd vdd vdd gnd out 2200 f a fig.5 i dd measurement circuit 5/12 technical (reference) data bu52004gul (v dd =2.4 ? 3.3v type) bu52014hfv (v dd =1.65 ? 3.3v type) fig.6 bop,brp ? ambient temperature fig.7 bop,brp ? supply voltage fig.12 bop,brp ? ambient temperature fig.13 bop,brp ? supply voltage -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 -40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] bop s brp s brp n bop n v dd =3.0v -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 2.02.42.83.23.6 supply voltage v magnetic flux density [mt] bop s brp s brp n bop n ta = 25c fig.10 i dd ? ambient temperature 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =3.0v fig.11 i dd ? supply voltage 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 2.0 2.4 2.8 3.2 3.6 supply voltage [v] average supply current [a] ta = 25c fig.8 t p ? ambient temperature 40 45 50 55 60 65 70 75 80 85 90 95 100 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =3.0v fig.9 t p ? supply voltage 0 10 20 30 40 50 60 70 80 90 100 2.0 2.4 2.8 3.2 3.6 supplly voltage[v] period [ms] ta = 25c -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 - 60 - 40 - 20 0 20 40 60 80 100 ambient temperature [ ] magnetic flux density [mt] v dd =1.8v bop s brp s brp n bop n -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 ! " # " supply voltage v magnetic flux density [mt] bop s brp s brp n bop n ta = 25c fig.16 i dd ? ambient temperature 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] average supply current [a] v dd =1.8v fig.17 i dd ? supply voltage 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage[v] average supply current [a] ta = 25c fig.14 t p ? ambient temperature 0 10 20 30 40 50 60 70 80 90 100 -60 -40 -20 0 20 40 60 80 100 ambient temperature [ ] period [ms] v dd =1.8v fig.15 t p ? supply voltage 0 10 20 30 40 50 60 70 80 90 100 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] period [ms] ta = 25c 6/12 block diagram bu52004gul bu52014hfv pin no. pin name function comment a1 vdd power supply a2 gnd ground b1 out1 output( respond the south pole) b2 out2 output( respond the north pole) pin no. pin name function comment 1 out2 output ( respond the north pole) 2 gnd ground 3 n.c. open or short to gnd. 4 vdd power supply 5 out1 output ( respond the south pole) $%& vdd dynamic offset cancellation ? sample & hold '( '( $%& )&& timing logic latch latch hall element a1 a2 b1 b2 the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. 0.1 f $%& vdd dynamic offset cancellation ? sample & hold '( '( $%& )&& timing logic latch latch hall element 4 2 5 1 0.1 f fig.18 fig.19 the cmos output terminals enable direct connection to the pc, with no external pull-up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. a1 b2 b1 a2 reverse ? a2 b2 b1 a1 surface ? reverse 1 2 5 3 3 surface 1 4 5 2 4 7/12 description of operations micropower operation (small current using intermittent action) (offset cancelation) (magnetic field detection mechanism) the dual output bipolar detection hall ic adopts an intermittent operation method to save energy. at startup, the hall elements, amp, comparator and other detection circuits power on and magnetic detection begins. during standby, the detection circuits power off, thereby reducing current consumption. the detection results are held while standby is active, and then output. reference period: 50ms (max100ms) reference startup time: 48 s i dd standby startup time period 50ms t fig.20 the hall elements form an equivalent wheatstone (resistor) bridge circuit. offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. a dynamic offset cancellation circuit is employed to cancel this offset voltage. when hall elements are connected as shown in fig. 21 and a magnetic field is applied perpendicular to the hall elements, voltage is generated at the mid-point terminal of the bridge. this is known as hall voltage. dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90? angle from its original path, and thereby cancels the hall voltage. the magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. * gnd v dd + i b hall voltage fig.21 the hall ic cannot detect magnetic fields that run horizontal to the package top layer. be certain to configure the hall ic so that the magnetic field is perpendicular to the top layer. fig.22 s s n s n s n flux direction flux direction 8/12 the out1 pin detects and outputs for the s-pole only. since it is unipolar, it does not recognize the n-pole. the out2 pin detects and outputs for the n-pole only. since it is unipolar, it does not recognize the s-pole. the dual output bipolar detection hall ic detects magnetic fields running perpendicular to the top surface of the package. ther e is an inverse relationship between magnetic flux density and the distance separating the magnet and the hall ic: when distance increases magnetic density falls. when it drops below the operate point (bop), output goes high. when the magnet gets closer to the ic and magnetic density rises, to the operate point, the output switches low. in low output mode, the distance from the magnet to the ic increases again until the magnetic density falls to a point just below bop, and output returns high. (this poi nt, where magnetic flux density restores high output, is known as the release point, brp.) this detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. flux b low brp s bop s 0 high n-pole magnetic flux density [mt] flux high high out 1[v] n n s s s n s-pole out1 fig.23 s-pole detection flux b bop n brp n 0 high n-pole magnetic density [mt] fig.24 ? n-pole detection flux high high low out 2[v] n n s s s n s-pole out2 9/12 intermittent operation at power on the dual output bipolar detection hall ic adopts an intermittent operation method in detecting the magnetic field during startup, as shown in fig. 25. it outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. the time from power on until the end of the initial startup period is an indefinite interv al, but it cannot exceed the maximum period, 100ms. to accommodate the system design, the hall ic output read should be programmed within 100ms of power on, but after the time allowed for the period ambient temperature and supply voltage. magnet selection of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment applications. fig. 26 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. the graph plots the correlation between the distance (l) from three versions of a 4mm x 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. fig. 27 shows hall ic detection distance ? a good guide for determining the proper size and detection distance of the magnet. based on the bu52014hfv operating point max 5.0 mt, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. to increase the magnet?s detection distance, either increase its thickness or sectional area. x=y=4mm t=1mm,2mm,3mm x t y ? flux density measuring point l: variable t fig.27 ? magnet dimensions and flux density measuring point magnet size magnet power on vdd startup time standby time standby time startup time (intermittent action) indefinite out (no magnetic field present) indefinite out (magnetic field present) low high supply current fig.25 0 1 2 3 4 5 6 7 8 9 10 02468101214161820 & ,- .,/ ,0,123..4 5,/ 67 83.(4 fig.26 7.6mm t=3mm t=1mm t=2mm 9.2mm 10.4mm magnet material: neomax-44h (material) maker: neomax co.,ltd. 10/12 ? position of the hall effect ic(reference) ? footprint dimensions (optimize footprint dimensions to the board design and soldering condition) terminal equivalent circuit diagram gnd vdd out1, out2 because they are configured for cmos (inverter) output, the output pins require no external resistance and allow direct connection to the pc. this, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. fig.28 ( unit mm ) ( unit mm ) 0.55 0.55 0.35 vcsp50l1 0.6 0.8 0.2 hvsof5 hvsof5 vcsp50l1 11/12 operation notes 1 absolute maximum ratings exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the ic. because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2 gnd voltage make sure that the gnd terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3 thermal design use a thermal design that allows for sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4 pin shorts and mounting errors use caution when positioning the ic for mounting on printed circuit boards. mounting errors, such as improper positioning or orientation, may damage or destroy the device. the ic may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or gnd. 5 positioning components in proximity to the hall ic and magnet positioning magnetic components in close proximity to the hall ic or magnet may alter the magnetic field, and therefore the magnetic detection operation. thus, placing magnetic components near the hall ic and magnet should be avoided in the design if possible. however, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. 6 slide-by position sensing fig.29 depicts the slide-by configuration employed for position sensing. note that when the gap (d) between the magnet and the hall ic is narrowed, the reverse magnetic field generated by the magnet can cause the ic to malfunction. as seen in fig.30, the magnetic field runs in opposite directions at point a and point b. since the dual output bipolar detection hall ic can detect the s-pole at point a and the n-pole at point b, it can wind up switching output on as the magnet slides by in the process of position detection. fig. 31 plots magnetic flux density during the magn et slide-by. although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. this demonstrates that slightly widening the gap (d) between the magnet and hall ic reduces the reverse magnetic field and prevents malfunctions. 7 operation in strong electromagnetic fields exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the ic to malfunction. 8) common impedance make sure that the power supply and gnd wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. also, take measures to minimize ripple such as using an inductor or capacitor. 9 gnd wiring pattern when both a small-signal gnd and high-current gnd are provided, single-point grounding at the reference point of the set pcb is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal gnd. in the same way, care must also be taken to avoid wiring pattern fluctuations in the gnd wiring pattern of external components. 10 exposure to strong light exposure to halogen lamps, uv and other strong light sources may cause the ic to malfunction. if the ic is subject to such exposure, provide a shield or take other measures to protect it from the light. in testing, exposure to white led and fluorescent light sources was shown to have no significant effect on the ic. 11) power source design since the ic performs intermittent operation, it has peak current wh en it?s on. please taking that into account and under examine adequate evaluations when designing the power source. l fig.29 d magnet hall ic slide -10 -8 -6 -4 -2 0 2 4 6 8 10 012345678910 horizontal distance from the magnet [mm] magnetic fux density[mt] reverse fig.31 fig.30 b s a n flux flux 12/12 product designations (selecting a model name when ordering) b u rohm model 5 0 2 0 4 package type gu l tr, e2 = reel-wound embossed taping e2 part number vscp50l1 hvsof5 : gul : hfv vscp50l1 hvsof5 : e2 : tr orders are available in complete units only. < tape/reel info > embossed carrier tape tr (correct direction: with reel in the left hand, the 1pin of the product should be at the upper left. pull tape out with the right hand) tape quantity direction of feed 3000 p cs reel feed direction 1pin xxx xxx xxx xxx xxx xxx xxx xxx x x x xx x hvsof5 notes no technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of rohm co.,ltd. the contents described herein are subject to change without notice. the specifications for the product described in this document are for reference only. upon actual use, therefore, please request that specifications to be separately delivered. application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. rohm co.,ltd. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by rohm co., ltd. is granted to any such buyer. products listed in this document are no antiradiation design. appendix1-rev2.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / europe / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2008 rohm co.,ltd. the products listed in this document are designed to be used with ordinary electronic equipment or de vices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. it is our top priority to supply products with the utmost quality and reliability. however, there is always a chance of failure due to unexpected factors. therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. rohm cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the notes specified in this catalog. 21 saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix |
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